HDI Electronic PCB board,IC PCB board

1.Electronic PCB board/printed circuit board 2.10years experience about PCB and PCBA 3.FR1 FR4 CM1 CM3 4.1-24layers 5.OHSAS

HDI Electronic PCB board,IC PCB board,

Suface finishing:Immersion gold/silver,OSP,HASL,ENIG,Tin-plating,Gold finger

Solder mask:White,Blue,Red,Green,Black

	Specification Inch (mm)
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium
Layer No.	1 2
Board thickness	0.015"(0.4mm)-0.125"(3.2mm)
Board Thickness Tolerance	±10%
Cooper thickness	1/2OZ-3OZ
Impedance Control	±10%
Warpage	0.075%-1.5%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
				Min Trace Width (a)	0.005"(0.125mm)
Min Space Width (b)	0.005"(0.125mm)
Min Annular Ring	0.005"(0.125mm)
SMD Pitch (a)	0.012"(0.3mm)
BGA Pitch (b)	0.027"(0.675mm)
Regesiter torlerance	0.05mm
				Min Solder Mask Dam (a)	0.005"(0.125mm)
Soldermask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)
				Hole size	0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Aspect Ratio	6:01
Hole Registration	0.004"(0.1mm)
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au:1-3u'
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	±0.004'(±0.1mm)
Beveling	30°45°
V-cut	15° 30° 45° 60°
Certificate	ROHS  ISO9001:2000  TS16949  SGS  UL

         

         

   

HDI Electronic PCB board,IC PCB board